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Intel®, Packaging Data Book

Flash Packaging Web Page


Architecture:
Type :
Last Update:

MCS(R) 51/151/251 Microcontrollers Classic
Packaging Information
4/17/98 5:45:51 PM

Vendor Information


Tool Description:

Contains information on ALL of Intel's packages

This tool will link you to the Flash memory component packaging data web page where the Intel Packaging Data Book resides. Simply click on the blue 'Flash Packaging Web Page' title above and click on the URL path in the vendor contact information area.

Tool Features:

  • Package/ Module/ PC card outlines and dimensions

  • IC assembly technology

  • Component handling precautions

  • Moisture sensitivity/ desiccant packing,handling of PSMC's

  • Board solder reflow process recommendations

  • Transport media and packing

  • Performance characteristics of IC packages

  • Physical constants of IC package materials

  • Surface mount technology

  • International packaging specifications

    • Development Platform(s):

    File Attachments:

    Supported Device Detail Matrix:

    		Part & Package

    		8XC151 - 40ldPDIP
    8XC151 - 44ldPLCC
    8XC151 - BLANK
    8XC152JX - 68ldPLCC
    8XC3X - 40ldPDIP
    8XC3X - 44ldPDIP
    8XC3X - 44ldPLCC
    8XC3X - 44ldQFP
    8XC51X - 40ldPDIP
    8XC5X - 40ldCerDIP
    8XC5X - 40ldPDIP
    8XC5X - 44ldPDIP
    8XC5X - 44ldPLCC
    8XC5X - 44ldQFP


    Vendor Information:


    Flash Packaging Web Page


    ,

    URL : http://www.intel.com/design/flcomp/packdata

    Contact the vendor above for the latest Distributor information



    * Legal Information © 1998 Intel Corporation